Chemical

In semiconductor water etching
and cleaning process Used
chemicals and inorganic
coating chemicals

H₃PO₄

Phosphoric Acid (H₃PO₄)

Description

CAS No. 7664-38-2

Applications

Semiconductor Fabrication (Etching Process)
Form : Liquid / Acid
Effect : Etching Nitride off the SiO2 Water
Usage : Wet Etching Process in Semiconductor

Paramerter	Spec	Detection Limit	Analysis	Measured Value	Unit	Measurement Type
Cylinder Predssure			33		PSIG	Vapour
Chemical Purity	99.998	99.998	>99.998	By Difference	%	Vapour
Chlorosilanes	0.2	0.2	ND < 0.2	Validation	PPMV	Vapour
CO	1	0.1	ND < 0.1	GC	PPMV	Vapour
CO2	1	0.1	ND < 0.1	GC	PPMV	Vapour
Hydrogen	200	0.1	0.5	GC	PPMV	Vapour
Water	1	0.5	ND < 0.5	Hygrometer	PPMV	Vapour
Higher Silanes	50	5	0.1	GC	PPMV	Vapour
Nitrogen	1	0.1	ND < 0.1	GC	PPMV	Vapour
O2 + Ar	1	0.1	ND < 0.1	GC	PPMV	Vapour
Silane	1000	5	11	GC	PPMV	Vapour
Siloxanes	5	5	ND < 5	GC	PPMV	Vapour
THC as CH4	1	0.1	ND < 0.1	GC	PPMV	Vapour
Requested Net Weight	10				KG
Actual Net Weight			10088.7		GM

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